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KMID : 0362320040290060504
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Journal of Korean Academy of Operative Dentistry
2004 Volume.29 No. 6 p.504 ~ p.514
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Dentin bond strength of bonding agents cured with Light Emitting Diode
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김선영/Kim SY
이인복/조병훈/손호현/김미자/석창인/엄정문/Lee IB/Cho BH/Son HH/Kim MJ/Seok CI/Um CM
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Abstract
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KEYWORD
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